Schaumburg, Illinois, USA, October 1, 2007 - OMRON RFID (www.omronrfid.com) today announced that the 'Scorpion', the latest addition to its UHF EPC Gen2 family of RFID inlays, will be on display at EPC Connection 2007, Booth 101.* The 'Scorpion', which is designed to seize the growing section of the RFID tag market that demands long read range in a compact form factor, is scheduled for launch in the North American market in early November 2007.

Measuring 28mm x 68mm (1.1" x 2.7") and covering a wide band of the UHF spectrum (860MHz to 960MHz), the 'Scorpion' is a sleek, globally-compatible inlay ideal for a range of applications in retail, logistics, access control, asset management, manufacturing and transportation.

The 'Scorpion's' versatile credit-card size allows easy conversion to popular formats, including 4"x2", 4"x6" and 3"x3" logistics labels for cases as well as ID cards and crate tags. Used to track stock shipments to RFID-enabled stores, for example, 'Scorpion'-powered labels offer a powerful solution to out-of stock (OOS) situations at retail outlets running special promotions. The new inlay also fits snugly into credit-card sized items such as gate passes and other access control applications.

"OMRON understands that our customers have diverse RFID tag needs," said Masa Kameyama, OMRON RFID's US Division Manager. "In the UHF frequency, we currently offer the globally-compatible 'Wave' inlay for general purpose use, the 'Loop' for robust read performance when applied to RFID-unfriendly materials and the 'Ninja' for item-level tagging and pharmaceutical applications. We developed the 'Scorpion' in response to customer requests for an inlay that offers a read range comparable to the 'Wave' and 'Loop' with global compatibility in a smaller profile."

Kameyama continued, "With the release of the 'Scorpion', OMRON's inlay solutions now cover the full range from pallet, case and item-level tagging through to security applications such as access control and asset management. What's more, all OMRON UHF inlays are manufactured using our patented ultra-sonic bonding technology, JOMFUL, for unsurpassed reliability from one of the strongest IC chip - antenna bonds in the industry."

*EPC Connection 2007 will run from October 2-4, 2007 at the Donald E. Stephens Convention Center in Chicago.

Please direct inquiries regarding this press release to: Masa Kameyama at OMRON RFID: (888) 303-7343 (RFID)

OMRON Expands RFID UHF EPC Gen2 Inlay Product Range