OMRON TECHNICS -Technical Papers-

The Great Hanshin-Awaji Earthquake of 1995 and the Great East Japan Earthquake of 2011 resulted in a large-scale disaster, such as building collapses and fires. Therefore, it is recognized that the grasp of building damage is important for the early reconstruction of the region and...

Magnetic materials like ferrite, which is used in power supply circuits that handle high currents, such as DC/DC converters, exhibit a rapid decrease in inductance due to the influence of the magnetic flux generated as the DC current component increases. This phenomenon is called DC superposition,...

By the arrival of the IoT era, embedded devices that connect to the Internet are being exposed to cyberattacks¹⁾. In order to provide products that users can use with assurance, it is necessary to analyze security threats and take countermeasures to avoid important cyberattacks. OMRON....

The size of passive components mounted on boards composing a product has been decreasing. Mainstream size will be 0603 (0.6 × 0.3 mm) and 0402 (0.4 × 0.2 mm), whereas the conventional sizes are 1608 (1.6 × 0.8 mm), 1005 (1.0....

One of the common subjects among the product development is the excess of development lead-time and cost, and the degradation of the products due to the redesign work by the problems that occurred at later parts of the product development....

In recent years, because of growing concerns about environmental issues, the bonding of dissimilar materials (metal and resin, etc.) has been increasing for the purpose of improving the energy efficiency of products by miniaturization and weight reduction....

Many companies have call centers to answer telephone calls from their customers. Call centers’ two major indices, service quality and running costs, have a trade-off relation; improving service quality needs additional operators, who require additional costs...

Not only high-function electronic products such as PCs and smartphones but also the products such as FA equipment and power electronics products have being downsized. The heat capacity of the printed wiring board (PWB) is increasing due to multi-layering...

The size of passive components mounted on the boards composing the product has been increased from the conventional 1608M (1.6 × 0.8 mm) and 1005M (1.0 × 0.5 mm) to 0603M (0.6 × 0.3 mm) and 0402M (0.4 × 0.2 mm) are becoming mainstream. Though these parts...

Software is becoming larger and more complex mainly due to higher functionality of the product, software implementation of functions what used to be realized by hardware. As a result, increasing development and quality costs, frequent schedule...