OMRON TECHNICS -Technical Papers-
This webpage introduces technical papers that describe the outcomes of the OMRON Group’s R&D activities, as well as the technologies that support its products and services.
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The Great Hanshin-Awaji Earthquake of 1995 and the Great East Japan Earthquake of 2011 resulted in a large-scale disaster, such as building collapses and fires. Therefore, it is recognized that the grasp of building damage is important for the early reconstruction of the region and...
- Verification Technology
- Earthquake
- Simulation
- Acceleration
- Vibration Sensors
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Magnetic materials like ferrite, which is used in power supply circuits that handle high currents, such as DC/DC converters, exhibit a rapid decrease in inductance due to the influence of the magnetic flux generated as the DC current component increases. This phenomenon is called DC superposition,...
- DC Superposition
- Minor Loop
- Magnetic field analysis
- Incremental Permeability
- Power Electronics
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By the arrival of the IoT era, embedded devices that connect to the Internet are being exposed to cyberattacks1). In order to provide products that users can use with assurance, it is necessary to analyze security threats and take countermeasures to avoid important cyberattacks. OMRON....
- IoT
- Security
- Threat analysis
- Secure by design
- Software engineering
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2020/11/12
Solder Vibration Printing Technology that Enables Mixed Mounting from 0402 to Large Components
The size of passive components mounted on boards composing a product has been decreasing. Mainstream size will be 0603 (0.6 × 0.3 mm) and 0402 (0.4 × 0.2 mm), whereas the conventional sizes are 1608 (1.6 × 0.8 mm), 1005 (1.0....- Surface mount
- Solder paste printing
- 0402M
- Ultrasonic vibration
- High aspect ratio
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2020/11/12
Innovation of the Method for Balancing Trade-off Requirements in the Product Design Process
One of the common subjects among the product development is the excess of development lead-time and cost, and the degradation of the products due to the redesign work by the problems that occurred at later parts of the product development....- Design Optimization
- CAE application technology
- Trade-off balancing
- Design quality improvement
- Design knowledge formalization
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In recent years, because of growing concerns about environmental issues, the bonding of dissimilar materials (metal and resin, etc.) has been increasing for the purpose of improving the energy efficiency of products by miniaturization and weight reduction....
- Adhesive
- Thermal cure
- Spot heat
- High-speed curing
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Many companies have call centers to answer telephone calls from their customers. Call centers’ two major indices, service quality and running costs, have a trade-off relation; improving service quality needs additional operators, who require additional costs...
- AI
- Time Series Analysis
- Space State Model
- Prediction
- Call Center
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Not only high-function electronic products such as PCs and smartphones but also the products such as FA equipment and power electronics products have being downsized. The heat capacity of the printed wiring board (PWB) is increasing due to multi-layering...
- JISSO technology
- Wave soldering
- Process control
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The size of passive components mounted on the boards composing the product has been increased from the conventional 1608M (1.6 × 0.8 mm) and 1005M (1.0 × 0.5 mm) to 0603M (0.6 × 0.3 mm) and 0402M (0.4 × 0.2 mm) are becoming mainstream. Though these parts...
- JISSO Technology
- Solder printing
- Solder paste
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Software is becoming larger and more complex mainly due to higher functionality of the product, software implementation of functions what used to be realized by hardware. As a result, increasing development and quality costs, frequent schedule...
- Software Engineering
- Software Product Lines
- Software Architecture
- Human Resource Development
- Process Improvement