This webpage introduces technical papers that describe the outcomes of the OMRON Group’s R&D activities, as well as the technologies that support its products and services.
2021/08/27By the arrival of the IoT era, embedded devices that connect to the Internet are being exposed to cyberattacks1). In order to provide products that users can use with assurance, it is necessary to analyze security threats and take countermeasures to avoid important cyberattacks. OMRON....
- Threat analysis
- Secure by design
- Software engineering
2020/11/12The size of passive components mounted on boards composing a product has been decreasing. Mainstream size will be 0603 (0.6 × 0.3 mm) and 0402 (0.4 × 0.2 mm), whereas the conventional sizes are 1608 (1.6 × 0.8 mm), 1005 (1.0....
- Surface mount
- Solder paste printing
- Ultrasonic vibration
- High aspect ratio
2020/11/12One of the common subjects among the product development is the excess of development lead-time and cost, and the degradation of the products due to the redesign work by the problems that occurred at later parts of the product development....
- Design Optimization
- CAE application technology
- Trade-off balancing
- Design quality improvement
- Design knowledge formalization
There is a growing need for miniaturization and high capacity of electronic components along with the trend of miniaturization and energy saving of the equipment, but these requirements have increased the influence of heat on electronic....
- Thermal deformation
- Resin parts
- Anisotropic material
- Molding material
2020/11/12In recent years, because of growing concerns about environmental issues, the bonding of dissimilar materials (metal and resin, etc.) has been increasing for the purpose of improving the energy efficiency of products by miniaturization and weight reduction....
- Thermal cure
- Spot heat
- High-speed curing
In recent years, the growing interest in environmental problems has stimulated the urgent spread and efficiency improvement of renewable energy. Energy efficiency increases the rated voltage and the current of electrical devices, and the devices require higher interruption....
- High electrical durability relay
- Simulation technology to quantify arc interruption phenomena
- Analysis for electromagnetic and thermal phenomena
- Energy management device for environmental usage
- Improvement for arc interruption
Many companies have call centers to answer telephone calls from their customers. Call centers’ two major indices, service quality and running costs, have a trade-off relation; improving service quality needs additional operators, who require additional costs...
- Time Series Analysis
- Space State Model
- Call Center
2020/03/10Simulation technology for realizing high capacity of relayIt is very important for design to predict the dynamic motion of contact for realizing downsizing and high capacity for a mechanical relay along with trend of downsizing of application devices and saving energy. In order to predict the dynamic motion of contact...
- Coupled analysis
- Dynamic motion analysis
- Contact bounce
- Breaking velocity
- High capacity of relay
Not only high-function electronic products such as PCs and smartphones but also the products such as FA equipment and power electronics products have being downsized. The heat capacity of the printed wiring board (PWB) is increasing due to multi-layering...
- JISSO technology
- Wave soldering
- Process control
Many electronic devices such as relays, switches and FA sensors are used in the various environments, and they are protected by seal to guarantee their movements. In particular, in applications where outdoor use, water including salt (saltwater) such...
- Saltwater intrusion
- Penetration distance estimation
- Evaluation technology
- Electronic equipment
2020/03/10The size of passive components mounted on the boards composing the product has been increased from the conventional 1608M (1.6 × 0.8 mm) and 1005M (1.0 × 0.5 mm) to 0603M (0.6 × 0.3 mm) and 0402M (0.4 × 0.2 mm) are becoming mainstream. Though these parts...
- JISSO Technology
- Solder printing
- Solder paste
Software is becoming larger and more complex mainly due to higher functionality of the product, software implementation of functions what used to be realized by hardware. As a result, increasing development and quality costs, frequent schedule...
- Software Engineering
- Software Product Lines
- Software Architecture
- Human Resource Development
- Process Improvement
2019/12/13About a challenge to automation in small-lot productionIn recent years, in order to grow further while maintaining its competitiveness in the environment surrounding the electronic parts business(Electronic &Mechanical Components, hereinafter referred to EMC)...
- Extraordinarily small self-controlled run robot
- New production system
- Functional investment analysis
- Low-cost pickup and placing robot
- Nonsynchronous transfer
2019/12/13Electrical durability design by numerical analysis approachRecently energy efficiency improvement of electrical equipment is promoted as environmental issues. This trend also accelerates both downsizing and switching capability for mechanical relays. We need to control...
- High electrical durability relay
- Dynamics simulation technology
- Electrical durability design
- Electromagnetic analysis
- Eco-friendly equipment