B3DA Ultra-low Profile Dome Array Ultra-low Profile Dome Array with Dust-Proof Construction and Crisp Clicking Action. No soldering required. Attach directly to PCB to make tactile switch. Matrix adhesive used to create highly dust-proof construction with good ventilation. Lower profile, lighter weight, and crisp clicking action achieved using stainless steel contact dome. OMRON's unique circular contact action ensures a high level of resistance to foreign matter. Can be designed and produced according to user specifications (e.g., external dimensions or key layout).

Specifications

Item	Specification
Diameter	4-mm dia. and 5-mm dia. models available
Operating force (OF)	1.57 ± 0.49 N
Releasing force (RF)	0.2 N min.
Pretravel (PT)	0.2 ± 0.1 mm
Thickness	0.25 ± 0.1 mm
Life expectancy	4-mm dia.: 500,000 operations min. 5-mm dia.: 1,000,000 operations min.
Ambient operating temperature	-40 to 80ºC
Ambient storage temperature	-40 to 85ºC
Material	Stainless steel
Plating	Unplated, silver

Contact dome specifications not shown in this table are also available.

Recommended Contact Form on PCB
4-mm Diameter Contact Dome



5-mm Diameter Contact Dome

Precautions

Correct Use

Note:  Be sure to read the Industrial Components General Catalog (Y202) before using the Dome Arrays for general precautions.

Attaching to the PCB

Remove the Dome Array from the sheet using tweezers, and attach it above the contact on the PCB surface, which has been wiped clean in advance.

Do not reuse a B3DA Dome Array that has been detached from the PCB. Attach a new Dome Array to the PCB.

Do not touch the contact dome with bare hands, or with unclean gloves. Doing so may damage the contact dome, which is the part that comes in contact with the PCB.

Reflow Soldering

The Dome Array cannot withstand heat from reflow soldering. Always perform reflow soldering before attaching the Dome Array to the PCB.

Washing

Do not wash the Dome Array. The Dome Array is not water-resistant and must not be exposed to water or other liquids.