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Dome Arrays

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B3D Ultra-low Profile Dome Key
Single-key Type Added to Series of B3DA Ultra-low Profile Dome Arrays
  • No soldering required.
    Attach directly to PCB to make an ultra-low profile tactile switch.
    Construction provides strong resistance to static electricity by having no soldered terminals.
  • Matrix adhesive used to create highly dust-proof construction with good ventilation.
  • Lower profile, lighter weight, and crisp clicking action achieved using stainless steel contact dome.
  • OMRON's unique circular contact action ensures a high level of resistance to foreign matter.
XF2C
JPN
OrderingInformationDimensions
Specifications
Item Model
B3D-4112
B3D-5112
Diameter of contact dome
4-mm dia. 5-mm dia.
Operating force (OF)
1.67±0.49N
Releasing force (RF)
0.2 N min.
Pretravel (PT)
0.2±0.1mm
Thickness
0.3±0.1mm
Life expectancy
500,000 operations min. 1,000,000 operations min.
Switching capacity
12 VDC, 10 mA (resistive load)
(recommended minimum load: 3 VDC, 1 mA (resistive load)
Ambient operating temperature
-40 to 80ºC
Ambient storage temperature
-40 to 85ºC
Contact dome
Stainless steel
Plating
Silver
Note:  The Dome Keys are sold in units of 500 (20 sheets, with 25 Dome Keys per sheet). Orders must be made in multiples of 500 Dome Keys.


Recommended Contact Form

4-mm Diameter Contact Dome (B3D-4112)
B3D : Recommended Contact Form

5-mm Diameter Contact Dome (B3D-5112)
B3D : Recommended Contact Form
OrderingInformationDimensions
B3D-4112
B3DA:Dimensions1



B3D-5112
B3DA:Dimensions2

Recommended Operating Part Form



  Precautions
 
Correct Use
Note:  Be sure to read the Industrial Components General Catalog (Y202) before using the Dome Keys for general precautions.
 
Attaching to the PCB
Remove the Dome Key from the sheet using tweezers or a vacuum pick-up tool, and attach it above the contact on the PCB surface, which has been wiped clean in advance. Press down on the top surface using an elastic material, such as urethane rubber, and a force of 2.94 to 4.9 N. Place a positioning mark (circle) on the PCB for easy positioning.
Make sure that the position of the Dome Key is aligned correctly before use. Significant misalignment may result in short-circuits or reduced sensitivity.
Note:The recommended vacuum pick-up tool is the Hozan P-835 Vacuum Pick with an M suction pad (7-mm dia.).
Do not reuse a B3D Dome Key that has been detached from the PCB. Attach a new Dome Key to the PCB.
Do not touch the contact dome with bare hands, or with unclean gloves. Doing so may damage the contact dome, which is the part that comes in contact with the PCB.
 
Reflow Soldering
The Dome Key cannot withstand heat from reflow soldering. Always perform reflow soldering before attaching the Dome Key to the PCB.
 
Washing
Do not wash the Dome Key. The Dome Key is not water-resistant and must not be exposed to water or other liquids.