Change Text Size
Discontinuation Date: Mar. 31, 2013
Updated Aug. 31, 2012
This web page provides an excerpt from a datasheet. Refer to Datasheet and other applicable documents for more information.
|Plastic seal||Minimun packing unit|
|Coil rated voltage||Model|
|Basic type||SPDT||4.5VDC||G6Y-1||100 pcs/tray|
|Note:||Please clearly indicate the coil rated voltage (V) when ordering.
Example: G6Y-1 DC4.5
In addition, the delivered product and its package will be marked with voltage specification of □□ VDC.
|Rated current (mA)||Coil resistance (Ω)||Operating voltage (V)||Release voltage (V)||Max. allowed voltage (V)||Power consumption (mW)|
|Basic type||DC||4.5||44.4||101||75% max.||10% min.||150% (at 23ºC)||Approx. 200|
|Note:||1.||The rated current and coil resistance are measured at a coil temperature of 23ºC with a tolerance of ±10%.|
|2.||The Operating characteristics are measured at a coil temperature of 23ºC.|
|3.||The "Max. allowed voltage" is the maximum voltage that can be applied to the relay coil. It is not the maximum voltage that can be applied continuously.|
|Rated load||0.01 A at 30 VAC
0.01 A at 30 VDC
900 MHz, 1 W (see note)
|Rated carry current||0.5 A|
|Max. contact voltage||30 VAC
|Max. contact current||0.5 A|
|Max. switching capacity
|Item||250 MHz||900 MHz||2.5 GHz|
|Isolation||80 db min.||65 db min.||30 db min.|
|Insertion loss||0.5 dB max.||0.5 dB max.||---|
|V.SWR||1.5 max.||1.5 max.||---|
|Max. carry power||10 W||---|
|Max. switching power||10 W||---|
|Note:||*1.||The impedance of the measuring system is 50 Ω.
The table above shows preliminary values.
|*2||1.This value is for a load with V.SWR× 1.2.|
|Contact resistance (see note 1)||100 mΩ max.|
|Operating time||10 ms max. (approx. 5 ms)|
|Release time||5 ms max. (approx. 1 ms)|
|Insulation resistance (see note 2)||100 mΩ min.|
|Dielectric strength||1,000 VAC, 50/60 Hz for 1 min between coil and contacts|
|500 VAC, 50/60 Hz for 1 min between contacts of same polarity|
|500 VAC, 50/60 Hz for 1 min between coil and ground and between contacts and ground|
|Shock resistance||Destruction: 1,000 m/s2 (approx. 100G)
Malfunction: 500 m/s2 (approx. 50G)
|Error rate P level(reference value (see note 3))||10 mVDC, 10µA|
|Ambient temperature||Operating: -40ºC to 70ºC (with no icing)
Storage: -40ºC to 70ºC (with no icing)
|Ambient humidity||Operating: 35 to 85%
Storage: 35 to 85%
|Weight||Approx. 5 g|
|Note:||The table above shows preliminary values.|
|1.||Measurement Conditions: 5 VDC, 100 mA, voltage drop method|
|2.||Measurement Conditions: Measured at the same points as the dielectric strength using a 500-VDC ohmmeter.|
Note:The shaded and unshaded parts indicate the product's directional marks.
Using the Relay in a circuit where the Relay will be ON continu- ously for long periods (without switching) can lead to unstable contacts because the heat generated by the coil itself will affect the insulation, causing a film to develop on the contact surfaces. Be sure to use a fail-safe circuit design that provides protection against contact failure or coil burnout. Airtightness when cleaning will last 1 minute at 70℃. Complete cleaning within these conditions.
·It is advantageous to use the Micro Strip Line in highfrequency transmission circuits because a low-loss transmission can be constructed with this method. By etching the dielectric base which has copper foil attached to both sides, the Micro Strip Line will have a concentrated electric field between the lines and ground as shown in the following diagram.
·The characteristic impedance of the lines ZO is determined by the kind of base (dielectric constant), the base's thickness, and the width of the lines, as expressed in the following equation.
·W: Line width
εr: Effective dielectric constant
H: Dielectric base thickness
The copper foil thickness must be less than H.
The following graph shows this relationship.
·For example, when creating 50-Ω lines using a glass epoxy base with a thickness of 1.6 mm, the above graph will yield a w/h ratio of 1.7 for a dielectric constant of 4.8. Since the base thickness is 1.6 mm, the width will be h × 1.7 2.7 mm.
The thickness of the copper foil “t” is ignored in this design meth- od, but it must be considered because large errors will occur in extreme cases such as a foil thickness of t w.
Furthermore, with the Micro Strip Line design, the lines are too short for the G6Y's intended frequency bandwidths, so we can ignore conductive losses and the line's attenuation constant.
·The spacing of the Strip Lines and ground pattern should be comparable to the width of the Strip Lines.
·Design the pattern with the shortest possible distances. Exces- sive distances will adversely effect the high-frequency character- istics.
·Spread the ground patterns as widely as possible so that poten- tial differences are unlikely to develop between the ground pat- terns.
·To avoid potential short-circuits, do not place the pattern's leads near the point where the bottom of the Relay attaches to the board.
When washing the product after soldering the Relay to a PCB, use a water-based solvent or alcohol-based solvent, and keep the solvent temperature to less than 40℃. Do not put the Relay in a cold cleaning bath immediately after soldering.
Since this example emphasizes reducing mounting costs, expen- sive mounting methods such as through-hole boards are not shown. If such methods are to be used, the characteristics must be studied carefully using the actual board configuration.
When double-sided paper epoxy boards are used, the dielectric constant will be approximately the same as that of glass epoxy boards (εr=4.8).
The width of the Strip Lines for a board with t=1.6 mm is 2.7 mm for 50 Ω and 1.3 mm for 75 Ω. For a board with t=1.0 mm the width is 1.7 mm for 50 Ω and 0.8 mm for 75 Ω.
The following diagram shows an example pattern and the Micro Strip Lines connected to the contact terminals are formed with pattern widths derived from the description above. The width between the Micro Strip Lines and ground patterns are compara- ble to the Micro Strip Line width.
There are jumpers between the upper and lower patterns at the points marked with Xs in the diagram. Improved characteristics can be obtained with more jumper locations. This method yields isolation characteristics of 65 dB to 75 dB at 500 MHz and 50 dB at 900 MHz.
At this point in the diagram the component side is the entire ground pattern side, but set aside approximately 2.0 mm × 2.0 mm of the pattern for the contact terminals and coil terminals.
When a single-sided board is used, isolation characteristics of only 60 dB to 70 dB at 200 MHz can be obtained. When high fre- quency bands are to be used with a single-sided board, a metal plate can be placed between the base and Relay and connected to the ground pattern.
With this method a metal plate is placed between the Relay and base and connected to the pattern, as shown in the above dia- gram. The important point here is that 3 locations (the G6Y's ground terminal, the metal plate's bent tabs (A), and the ground pattern) are soldered together at the same time. This method combines an inexpensive single-sided board and inexpensive metal plate to yield the same characteristics as a double-sided board and good characteristics are obtained by grounding the G6Y's ground terminal and metal plate in the same place.
The metal plate must be attached to the base as described here. From this point, the methods used for Strip Line design are the same as for the double-sided board.
Be sure to securely attach the Relay's base surface to the board during installation. The isolation characteristics will be affected if the Relay lifts off the board.
As shown in the enlarged illustration of the cross-section of part A, the G6Y is designed to ensure better high-frequency charac- teristics if the stand-off part of the G6Y is in contact with the ground pattern of the PCB. Therefore, the ground terminal and stand-off part are electrically connected internally.
Should the through hole electrically connected to the contact ter- minal come in contact with the stand-off part, the contact will be short-circuited with the ground, which may cause in an accident. As a preventive measure, keep at least a distance of 0.3 mm between the stand-off part and the through hole or land.
For example, if the terminal hole on the PCB is 1 mm in diameter and the length B shown in the illustration is 1.4 mm, a distance of 0.3 mm or more will be provided between the through hole and stand-off part.