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Reflective
EE-SY1200 Photomicrosensor
(Reflective)
- Ultra-compact model.
- PCB surface mounting type.
- High S/N ratio
(High light current / Low leakage current)
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Updated January 17, 2011 |
This web page provides an excerpt from a datasheet.
Refer to Datasheet and other applicable documents for more information.
Absolute Maximum Ratings (Ta = 25ºC)
| Item |
Symbol |
Rated value |
Unit |
| Emitter |
Forward current |
IF |
50*1 | mA |
| Pulse forward current |
IFP |
500*2 |
mA |
| Reverse voltage |
VR |
4 |
V |
| Detector |
Collector-Emitter voltage |
VCEO |
30 |
V |
| Emitter-Collector voltage |
VECO |
5 |
V |
| Collector current |
IC |
20 |
mA |
| Collector dissipation |
PC |
50*1
|
mW |
| Operating temperature |
Topr |
−25 to +85 |
ºC |
| Storage temperature |
Topr |
−40 to +100 |
ºC |
| Reflow soldering temperature |
Topr |
240*3 |
ºC |
| Note: |
1. |
Refer to the temperature rating chart if the ambient temperature exceeds 25ºC. |
| |
2. |
The pulse width is 10 µs maximum with a frequency of
100 Hz. |
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3. |
Complete soldering within 10 seconds for reflow soldering. |
Electrical and Optical Characteristics (Ta = 25ºC)
| Item |
Symbol |
Value |
Unit |
Condition |
| MIN. |
TYP. |
MAX. |
| Emitter |
Forward voltage |
VF |
--- |
1.2 |
1.4 |
V |
IF = 20 mA |
| Reverse current |
IR |
--- |
--- |
10 |
μA |
VR = 4V |
| Peak emission wavelength |
λP |
--- |
940 |
--- |
nm |
--- |
| Detector |
Light current1 |
IL1 |
200 |
--- |
1000 |
μA |
IF = 10 mA, VCE = 2 V, Aluminum-deposited
surface, d = 4 mm*1 |
Light current2 |
IL2 |
150 |
--- |
--- |
μA |
IF = 4 mA, VCE = 2 V, Aluminum-de-posited
surface, d = 1 mm*1 |
| Dark current |
ID |
--- |
2 |
200 |
nA |
VCE = 10 V, 0 x |
| Leakage current1 |
ILEAK1 |
--- |
--- |
500 |
nA |
IF = 10 mA,VCE = 2 V with no reflection*2 |
Leakage current2 |
ILEAK2 |
--- |
--- |
200 |
nA |
IF = 4 mA,VCE = 2 V with no reflection*2 |
| Collector-Emitter saturated voltage |
VCE (sat) |
--- |
--- |
--- |
V |
--- |
| Peak spectral sensitivity wavelength |
λP |
--- |
850 |
--- |
nm |
--- |
| Rising time |
tr |
--- |
30 |
--- |
μs |
VCC = 2 V, RL = 1 kΩ, IL = 100 μA, d = 1 mm*1 |
| Falling time |
tf |
--- |
30 |
--- |
μs |
VCC = 2 V, RL = 1 kΩ, IL = 100 μA, d = 1 mm*1 |
| Note: |
1. |
The letter “d” indicates the distance between the top surface of the sensor and the sensing object. |
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2. |
Depends on the installed condition of the Photomicrosensor, the detector may receive the sensor's LED light and/or the external light which
is reflected from surroundings of the Photomicrosensor and /or the background object.
Please confirm the condition of the Photomicrosensor by actual intended application prior to the mass production use. |
Note.
Unless otherwise specified tolerances
are ±0.15.
No burrs dimensions are included in outline
dimensions.
The burrs dimensions are 0.15 MAX.
Diagonal line indicate the region is part
Au plating area.
Recommended Soldering Pattern

Note 1. The shaded portion in the
above figure may cause shorting.
Do not wire in this portion.
2. The dimensional tolerance for
the recommended soldering
pattern is ±0.1 mm.
Internal Circuit
| Terminal No. |
Name |
| A |
Anode |
| K |
Cathode |
| C |
Collector |
| E |
Emitter |
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