OMRON Foundry Service Process List     Process Equipment Remarks (Materials, Method) Wafer Inches Service 4" 5" 8" Wafer bond- ing Silicon-Glass anodic bonding Anodic bonder Silicon-Glass ○ ○ - MEMS Aligner for bonding - ○ Diffu- sion Implantation Ion Implantation Phos/Boron/As ○ ○ ○ IC Doped deposition Furnaces Phos/Boron Annealing Furnaces Phos/Boron/As Depo- sition Oxidation Furnaces Wet/Dry ○ ○ ○ IC Insulation film depositing LPCVD PSG/NSG/SiN Poly-Si - PECVD SiN ○ HDP thin film - - Sputter SiO2 ○ ○ - MEMS Metal Evaporator Au/Cr/Ni/SnAu Sputter Al/Ti/Pt/Ni/Cu Al/Al-Si/TiW/Pt ○ - - IC Al/Ti/TiN/W/Co - ○ ITO thin film depositing Sputter ITO ○ ○ - MEMS,EF Organic thin film depositing Evaporator   ○ EF Photo- litho- graphy Coating /Developing Coater/Developer Positive resists /Negative resists ○ ○ ○ MEMS,IC,EF Polyimide coater Polyimide Mask alignment /exposure MPA , PLA   - Back to front aligner Stepper ○ KrF excimer laser - - MEMS,IC Lift-off Process Coater/Developer With Metallization ○ ○ - MEMS Wet etch- ing SiO2 HF etch station   ○ ○ ○ MEMS,IC Silicon TMAH etch station   - KOH etch station With ECE MEMS Metal Metal etch station Al/Au/Cr/Ni Spin etcher Al IC Dry etch- ing Insulation film Plasma etcher Poly-Si/SiO2/SiN ○ ○ ○ MEMS,IC RIE SiO2/SiN MEMS Organic thin film O2 plasma stripper Resists MEMS,IC Silicon D-RIE   ○ - - MEMS RIE   - ○ MEMS,IC Metal RIE Al MEMS,IC CMP Plan- ariza- tion STI, ILD, W-plug CMP     - - ○ MEMS,IC Char- act- eriza- tion /Dic- ing /Cle- an- ing Character- ization Wafer inspector   - - ○ MEMS,IC FT-IR   ○ ○ MEMS Optical Profiler   SEM Out of C/R Film thickness measurement Insulating film/Resists  MEMS, IC,EF Suface profiler   CV measurement   FIB   EDAX   NEXIV(Laser line width measurement) Dicing Dicer Silicon, Glass Laser Dicer Silicon Cleaning Automated Cleaning Station RCA IC Manual Cleaning Station H2SO4/HNO3 /HF MEMS UV Cleaner   Ultrasonic Cleaner   Elec-t roform- ing Electro- forming Electroforming system Ni / Ni-Pd ○ ○ ○ EF External processing Laser cutter YAG laser Polishing machine   Removing Anode oxidation Oxidation Rep- lica- tion 2P:Photo Polymeri- zation UV transformer Resin on Glass Wafer up to 6inches in diameter (Please refer to us for more than 6inches) Repli- cation Laser marker YAG laser Spin coater Resin coating Wafer cleaning station with 7 bathes Inspection systems Automated 2T:Thermal Transfer Thermal transformer Hot embossing