OMRON

OMRON Electronic Components Web|English

Relays
Sensors
Foundry
By Part# / Name
By Category
Switches
Micro Sensing Devices
Face Recognition Sensor
Connectors
Optical Communication Devices
Foundry
MEMS Foundry ftf@f
Anodic bonding technology
Basic Technology for Electric Capacitive Sensor.
Covalently bond Si-O by Applying 800V-1000V under 300-500°C.
Wafer is aligned within the range of 10 µ m.
Anodic bonding technology
<< back
 
 
TOP
MEMS Foundry
Overview of MEMS Foundry Service
Features of OMRON's Foundry
Microfabrication Technology for MEMS
Applications
Products
Prototype
Terms for MEMS Technology
IC Foundry
Electroforming Foundry
Process List
Contact us
 
Back to top
© Copyright OMRON Corporation 1996-2009. All Rights Reserved.