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MEMS Foundry
Features of OMRON's Foundry
Full Set of Services from Development to Manufacturing
  OMRON's Minakuchi Factory in Shiga Pref. has the extensive experience in the field of MEMS Foundry for volume manufacturing which enables full set of services from development to manufacturing, and has shipped 25,000k pieces of MEMS products in total by 2006.
In addition, our new foundry, Omron Semiconductors Co.,Ltd. (incorporated in April, 2007 in Yasu, Shiga Pref.) possesses Japan's first mass production line for 8 inches.
We have variety of services to meet the customer's requirements from 4-5 inches wafer (with our conventional factory) to 8 inches.

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Metal Deposition Area Bonding Area Photolithography room
Metal Deposition Area Bonding Area Photolithography room
Floor space : 600sqm

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Bulk/Surface Micromachining technology and Facilities
  In addition to the common processes of manufacturing semiconductors - Bipolar Si Line, CMOS Line, OMRON offers MEMS technology and factory for Bulk Micromachining, such as Anodic Bonding, ECE, Deep RIE, and lines for Glass only, which differentiate from the conventional processes.
OMRON has long time experience in volume production for Anodic Bonding and ECE.
Moreover, as we have the technology and facilities for Surface Micromachining, we can develop and prototype devices with Surface MEMS processing and monolithic MEMS processing.

Bulk/Surface Micromachining technology and Facilities “d‹C‰»þw“IƒGƒbƒ`ƒ“ƒO —z‹ÉÚ‡‹Zp

Enabling small-lot prototyping, mass production, partial processing , and total processing
 
products prosesses

Development Phase of Customer
Development Phase of Customer

New Device for Laser Dicing
  Leading edge technology for dicing breakable wafer.
Please contact to local OMRON representatives for inquiries.
 
 
New Device for Laser Dicing
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Overview of MEMS Foundry Service
Features of OMRON's Foundry
Microfabrication Technology for MEMS
Applications
Products
Prototype
Terms for MEMS Technology
IC Foundry
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